Nov. 27, 2024
1145 aluminum alloy has high purity and stable chemical composition, making it suitable for CTP (Computer to Plate) plate bases that require high surface quality.
HC Aluminum Printing Materials Co., Ltd specializes in thermal CTP, PS plates, etc., with an annual production capacity of 6 million square meters.
HC Aluminum Printing Materials Co., Ltd is one of the leading manufacturers and wholesalers of CTP aluminum substrates in China.
As the printing industry develops towards high-end, personalized, and high value-added products, the market demand for high-quality CTP (Computer to Plate) materials continues to grow. During the production of CTP plates, aluminum substrates play a crucial role as one of the key raw materials, and their quality directly affects the efficiency of plate production and print quality.
Chemical Composition and Physical Properties
The chemical composition of CTP plate aluminum substrates must meet specific requirements to ensure good corrosion resistance, excellent machinability, and stable mechanical properties. Common aluminum alloy grades include 1145, 1150, 1060, and 1070. These alloys have high purity, which allows them to maintain good stability during production, ensuring that the final plate material has consistency and reliability during the printing process.
Mechanical Properties
CTP plate aluminum substrates must have good mechanical properties, including high strength, good ductility, and appropriate hardness, both at room temperature and during the high-temperature baking process. The strength of the aluminum substrate directly impacts the durability and print quality of the CTP plate. Especially during the baking process, the aluminum substrate needs to maintain stability under high temperatures without deforming, ensuring the accuracy and durability of the plate.
Thickness and Width Precision
The thickness of CTP plate aluminum substrates typically ranges from 0.14mm to 0.3mm, and the width ranges from 400mm to 1500mm. Precise control of thickness and width is essential to ensure the consistency of print quality. The thickness of the aluminum substrate must be carefully controlled to ensure image accuracy and print clarity during production. Additionally, the width precision of the aluminum substrate directly impacts its compatibility with printing machines. Substrates that are too wide or too narrow can affect production efficiency and product quality.
Surface Finish and Luminance
The surface of the aluminum substrate must have sufficient smoothness to avoid surface defects or irregularities that could interfere with the CTP plate production process. Surface luminance (also referred to as surface gloss) refers to the aluminum substrate's ability to reflect light, which directly affects the exposure process and image reproduction. High-quality aluminum substrates should have a uniformly smooth surface to ensure that images are clear and defect-free during exposure.
Edge Burr Control
Edge burrs on the aluminum substrate are an important factor affecting the production process. Burrs can damage equipment or create defects that are difficult to remove during subsequent processing. The edges of the aluminum substrate should be finely processed to ensure they are smooth and flat, reducing the presence of burrs, which ensures the high-quality production of CTP plates.
Dimensional Stability
The aluminum substrate for CTP plates should maintain dimensional stability during the production process to avoid deformation caused by external stresses or temperature fluctuations, which could affect the final plate's processing and print quality. The stability of the aluminum substrate directly impacts the precision of the CTP plate and the reliability of the printing results. Therefore, high standards of flatness and stability are required for aluminum substrates.
Common aluminum alloy grades for CTP plate substrates include 1145, 1150, 1060, and 1070.
| alloy | state | thickness | Thickness tolerance | Surface roughness(Rα) |
| 1145 aluminum CTP plate | H18 | 0.12-0.18m | 0.27mm±0.005mm | 0.25～0.30μm |
| H22 | ||||
| H26 | ||||
| H22 | ||||
| H26 |
| 1145 alloy chemical | |
| Chemical Element | % Present |
| Mn | 0.05 |
| Mg | 0.05 |
| Cu | 0.05 |
| Ti | 0.03 |
| V | 0.05 |
| Zn | 0.05 |
| Other (Each) | 0.05 |
| Aluminium (Al) | 99 |
| Material Sheet, Strip, Plate | Temper | Thickness (mm) | Tensile strength (N/mm²) | Elongation in 50mm % | ||||
| 0.5mm | 0.8mm | 1.3mm | 2.6mm | 30mm | ||||
| Alloy 1145 | O | 0.2 - 10 | 60-100 | 15 | 20 | 25 | 30 | 28 |
